Patent · US Active

Processing of one or more carrier bodies and electronic components by multiple alignment

US11502042B2 · kind B2 · utility

0Cited by

2References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thorsten Meyer · Regensburg, DE
Thomas Behrens · Madison, US
Martin Gruber · Schwandorf, DE
Thorsten Scharf · Regensburg, DE
Peter Strobel · Regensburg, DE

Key dates

Filing date	Jul 1, 2020
Grant date	Nov 15, 2022
Priority date	—
Expiry date	Jul 1, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/95136
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of mounting electronic components on one or more carrier bodies is disclosed. The method comprises providing a support body with at least one first alignment mark, mounting the one or more carrier bodies, each having at least one second alignment mark, on the support body by alignment between the at least one first alignment mark and the at least one second alignment mark. Thereafter, the method includes mounting the plurality of electronic components on a respective one of the one or more carrier bodies by alignment using the at least one second alignment mark.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.