Method for producing at least one device in compressive strained semiconductor
US11515148B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jun 29, 2020 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Sep 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76283
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method for producing a semiconductor device, including:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.