Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture

US11515244B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Bun Kian Tay · Melaka City, MY
• Mei Yih Goh · Melaka City, MY
• Martin Gruber · Schwandorf, DE
• Josef Hoeglauer · Munich, DE
• Michael Juerss · Regenstauf, DE
• Josef Maerz · Oberhaching, DE
• Thorsten Meyer · Regensburg, DE
• Thorsten Scharf · Regensburg, DE
• Chee Voon Tan · Seremban, MY

Key dates

• Filing date: Jan 21, 2020
• Grant date: Nov 29, 2022
• Expiry date: Aug 7, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/97
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A molded semiconductor package includes a lead frame having one or more first leads monolithically formed with a die pad and extending outward from the pad in a first direction. A semiconductor die is attached to the die pad at a first side of the die. A metal clip of a clip frame is attached to a power terminal at a second side of the die. One or more second leads monolithically formed with the metal clip extend outward from the clip in a second direction different than the first direction. A mold compound embeds the die. The first lead(s) and the second lead(s) are exposed at different sides of the mold compound and do not vertically overlap with one another. Within the mold compound, the clip transitions from a first level above the power terminal to a second level in a same plane as the leads.