Patent · US Active

Controlling concentration profiles for deposited films using machine learning

US11532525B2 · kind B2 · utility

0Cited by
3References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 3, 2021
Grant dateDec 20, 2022
Priority date
Expiry dateMar 10, 2041

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/67253
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Methods and systems for controlling concentration profiles of deposited films using machine learning are provided. Data associated with a target concentration profile for a film to be deposited on a surface of a substrate during a deposition process for the substrate is provided as input to a trained machine learning model. One or more outputs of the trained machine learning model are obtained. Process recipe data identifying one or more sets of deposition process settings is determined from the one or more outputs. For each set of deposition process setting, an indication of a level of confidence that a respective set of deposition process settings corresponds to the target concentration profile for the film to be deposited on the substrate is also determined. In response to an identification of the respective set of deposition process settings with a level of confidence that satisfies a level of confidence criterion, one or more operations of the deposition process are performed in accordance with the respective set of deposition process settings.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.