Plasma parameters and skew characterization by high speed imaging
US11545376B2 · kind B2 · utility
0Cited by
8References
20Claims
0Family size
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Key dates
| Filing date | Jul 28, 2020 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Feb 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure relate to a method and an apparatus for monitoring plasma behavior inside a plasma processing chamber. In one example, a method for monitoring plasma behavior includes acquiring at least one image of a plasma, and determining a plasma parameter based on the at least one image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.