Device and method for bonding substrates
US11697281B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2021 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | Jan 27, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/17
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.