Patent · US Active

Package with separate substrate sections

US11710684B2 · kind B2 · utility

0Cited by

2References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Frank Singer · Regenstauf, DE
Martin Gruber · Schwandorf, DE
Thorsten Meyer · Regensburg, DE
Thorsten Scharf · Regensburg, DE
Peter Strobel · Regensburg, DE
Stefan Woetzel · Erfurt, DE

Key dates

Filing date	Oct 14, 2020
Grant date	Jul 25, 2023
Priority date	—
Expiry date	Jan 19, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package is disclosed. In one example, the package comprises a substrate having at least one first recess on a front side and at least one second recess on a back side, wherein the substrate is separated into a plurality of separate substrate sections by the at least one first recess and the at least one second recess, an electronic component mounted on the front side of the substrate, and a single encapsulant filling at least part of the at least one first recess and at least part of the at least one second recess. The encapsulant fully circumferentially surrounds sidewalls of at least one of the substrate sections.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.