Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11745302B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2021 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Aug 23, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y70/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.