Patent · US Active

Method for determining corrections for lithographic apparatus

US11754931B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignee

ASML NETHERLANDS B.V. · NL

Inventors

Roy Werkman · Eindhoven, NL
David Deckers · Schilde, BE
Simon Philip Spencer Hastings · San Jose, US
Jeffrey Thomas Ziebarth · San Jose, US
Samee Ur Rehman · Milpitas, US
Davit Harutyunyan · San Jose, US
Chenxi Lin · Beijing, CN
Yana Cheng · San Jose, US

Key dates

Filing date	Mar 18, 2020
Grant date	Sep 12, 2023
Priority date	—
Expiry date	Aug 14, 2040

Classification

Technology area (CPC G)Physics
CPC primaryG03F7/70616
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A method for determining a correction for an apparatus used in a process of patterning substrates, the method including: obtaining a group structure associated with a processing history and/or similarity in fingerprint of to be processed substrates; obtaining metrology data associated with a plurality of groups within the group structure, wherein the metrology data is correlated between the groups; and determining the correction for a group out of the plurality of groups by applying a model to the metrology data, the model including at least a group-specific correction component and a common correction component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.