Patent · US Active

Semiconductor packages, and methods for forming semiconductor packages

US11764187B2 · kind B2 · utility

0Cited by

4References

14Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Bernd Waidhas · Nittendorf, DE
Georg Seidemann · Landshut, DE
Thomas Wagner · Regelsbach, DE
Andreas Wolter · Regensburg, DE
Andreas Augustin · Munich, DE
Sonja Koller · Regensburg, DE
Thomas Ort · Veitsbronn, DE
Reinhard Mahnkopf · Oberhaching, DE

Key dates

Filing date	Sep 29, 2017
Grant date	Sep 19, 2023
Priority date	—
Expiry date	Sep 29, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2225/1064
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a first semiconductor die, a semiconductor device comprising a second semiconductor die, and one or more wire bond structures. The wire bond structure includes a bond interface portion. The wire bond structure is arranged next to the first semiconductor die. The first semiconductor die and the bond interface portion of the wire bond structure are arranged at the same side of the semiconductor device. An interface contact structure of the semiconductor device is electrically connected to the wire bond structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.