Apparatus for post exposure bake of photoresist
US11815816B2 · kind B2 · utility
1Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2021 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | May 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes is provided herein. The method and apparatus include an electrode assembly and a base assembly. The electrode assembly includes a permeable electrode. The base assembly includes one or more process fluid channels disposed around a circumference of the substrate support surface and configured to fill a process volume with a process fluid. The electrode assembly is configured to apply an electric field to a substrate disposed within the process volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.