Hydrophilic and zeta potential tunable chemical mechanical polishing pads

US11826876B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Sivapackia Ganapathiappan · Palo Alto, US
• Boyi Fu · San Jose, US
• Ashwin CHOCKALINGAM · San Jose, US
• Ankit Vora · San Jose, US
• Daniel Redfield · معلمی نژاد, US
• Rajeev Bajaj · Fremont, US
• Nag B. Patibandla · Pleasanton, US
• Hou T. Ng · Campbell, US
• Sudhakar Madhusoodhanan · Sunnyvale, US

Key dates

• Filing date: Apr 4, 2019
• Grant date: Nov 28, 2023
• Expiry date: May 5, 2042

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P10/25
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.