Method of forming retaining ring with shaped surface

US11850703B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Hung Chih Chen · San Jose, US
• Steven M. Zuniga · Soquel, US
• Charles C. Garretson · Sunnyvale, US
• Douglas R. McAllister · Pleasanton, US
• Jian Lin · Milpitas, US
• Stacy Meyer · San Jose, US
• Sidney P. Huey · Fremont, US
• Jeonghoon Oh · San Jose, US
• Trung T. Doan · Los Gatos, US
• Jeffrey P. Schmidt · San Jose, US
• Martin S. Wohlert · San Jose, US
• Kerry F. Hughes · San Jose, US
• James C. Wang · Saratoga, US
• Danny Cam Toan Lu · San Francisco, US
• Romain Beau De Lamenie · Menlo Park, US
• Venkata R. Balagani · Gilroy, US
• Aden Martin Allen · Austin, US
• Michael Jon Fong · Mill Valley, US

Key dates

• Filing date: Feb 9, 2023
• Grant date: Dec 26, 2023
• Expiry date: Feb 9, 2043

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49815
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.