Process chamber with reduced plasma arc
US11875969B2 · kind B2 · utility
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2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2020 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Aug 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3438
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A processing system comprises a chamber body, a substrate support and a lid assembly. The substrate support is located in the chamber body and comprises a first electrode. The lid assembly is positioned over the chamber body and defines a processing volume. The lid assembly comprises a faceplate, a second electrode positioned between the faceplate and the chamber body, and an insulating member positioned between the second electrode and the processing volume. A power supply system is coupled to the first electrode and the faceplate and is configured to generate a plasma in the processing volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.