Apparatus for post exposure bake of photoresist
US11934103B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2022 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Sep 5, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes is provided herein. The method and apparatus include a transfer device and a plurality of modules. The transfer device is configured to rotate a plurality of substrates between each of the modules, wherein one module includes a heating pedestal and another module includes a cooling pedestal. One module is utilized for inserting and removing the substrates from the system. At least the heating module is able to be sealed and filled with a process volume before applying the electric field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.