Semiconductor processing tool platform configuration with reduced footprint
US11996307B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2021 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Aug 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67207
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing system includes a factory interface having a controlled environment and a transfer chamber. The transfer chamber includes four first facets and three second facets, where each of the three second facets has a width that is narrower than that of each of the four first facets. A first processing chamber is attached to one of the four first facets. A first auxiliary chamber is attached to a first of the three second facets, where the first auxiliary chamber is smaller than the first processing chamber. A load lock is attached to a second of the three second facets and to the factory interface. A robot is attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the first processing chamber, the first auxiliary chamber, and the load lock.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.