Multi-thermal CVD chambers with shared gas delivery and exhaust system

US12037701B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Zhiyuan Ye · San Jose, US
• Shu-Kwan LAU · Sunnyvale, US
• Brian H. Burrows · San Jose, US
• Lori D. Washington · Union City, US
• Herman Diniz · Fremont, US
• Martin A. Hilkene · Gilroy, US
• Richard O. Collins · Santa Clara, US
• Nyi O. Myo · San Jose, US
• Manish Hemkar · Sunnyvale, US
• Schubert S. Chu · San Francisco, US

Key dates

• Filing date: Mar 31, 2021
• Grant date: Jul 16, 2024
• Expiry date: Mar 31, 2041

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C30B25/08
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method and apparatus for a process chamber for thermal processing is described herein. The process chamber is a dual process chamber and shares a chamber body. The chamber body includes a first and a second set of gas inject passages. The chamber body may also include a first and a second set of exhaust ports. The process chamber may have a shared gas panel and/or a shared exhaust conduit.