Wafer edge ring lifting solution

US12094752B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Michael R. Rice · Pleasanton, US
• Yogananda Sarode Vishwanath · Bengaluru, IN
• Sunil Srinivasan · Milpitas, US
• Rajinder Dhindsa · Pleasanton, US
• Steven E. Babayan · Los Altos, US
• Olivier Luere · Sunnyvale, US
• Denis M. Koosau · Sunnyvale, US
• Imad Yousif · San Jose, US

Key dates

• Filing date: Jun 17, 2022
• Grant date: Sep 17, 2024
• Expiry date: Jun 17, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J2237/334
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a process kit for processing a substrate is provided. The process kit has a support ring comprising an upper surface having an inner edge disposed at a first height and an outward edge disposed at a second height less than the first height, the inner edge having a greater thickness than the outward edge. An edge ring is disposed on the support ring, an inner surface of the edge ring interfaced with the inner edge of the support ring. A cover ring is disposed outward of the edge ring, the edge ring independently moveable relative to the support ring and the cover ring. Push pins are disposed inward of the cover ring, the push pins operable to elevate the edge ring while constraining radial movement of the support ring.