High conductance inner shield for process chamber
US12100577B2 · kind B2 · utility
0Cited by
25References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2019 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Mar 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/335
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes a tubular body having a central opening configured to surround a substrate support, wherein sidewalls of the tubular body do not include any through holes; and a top plate coupled to an upper end of the tubular body and substantially covering the central opening, wherein the top plate has a gas inlet and has a diameter that is greater than an outer diameter of the tubular body, and wherein the tubular body extends straight down from the top plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.