Processing system and method of delivering a reactant gas
US12139790B2 · kind B2 · utility
0Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2020 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Jan 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67017
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Embodiments described herein generally relate to a processing system and a method of delivering a reactant gas. The processing system includes a substrate support system, an injection cone, and an intake. The injection cone includes a linear rudder. The linear rudder is disposed such that the flow of reactant gas through the injection cone results in film growth on a specific portion of a substrate. The method includes flowing the gas through the injection cone and delivering the gas onto the substrate below. The localization of the reactant gas, allows for film growth on a specific portion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.