Patent · US Active

Substrate processing monitoring

US12165934B2 · kind B2 · utility

0Cited by

3References

18Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Zuoming ZHU · Sunnyvale, US
Shu-Kwan LAU · Sunnyvale, US
Ala Moradian · Sunnyvale, US
Enle CHOO · Saratoga, US
Flora Fong-Song CHANG · Saratoga, US
Vilen K. NESTOROV · Pleasanton, US
Zhiyuan Ye · San Jose, US
Bindusagar Marath Sankarathodi · San Jose, US
Maxim D. SHAPOSHNIKOV · Sunnyvale, US
Surendra Singh SRIVASTAVA · Santa Clara, US
Zhepeng CONG · San Jose, US
Patricia M. Liu · Saratoga, US
Errol C. Sanchez · Tracy, US
Jenny Lin · Saratoga, US
Schubert S. Chu · San Francisco, US
Balakrishnam R. JAMPANA · Santa Clara, US

Key dates

Filing date	Jul 24, 2020
Grant date	Dec 10, 2024
Priority date	—
Expiry date	Dec 20, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/12
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed first radiation signal. The processing chamber includes a substrate support configured to support the substrate within a processing volume and a controller coupled to a first sensing device configured to receive the first radiation signal.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.