Substrate measurement subsystem
US12283503B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2021 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | Jul 29, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for a substrate measurement subsystem is provided. An indication is received that a substrate being processed at a manufacturing system has been loaded into a substrate measurement subsystem. First positional data of the substrate within the substrate measurement subsystem is determined. One or more portions of the substrate to be measured by one or more sensing components of the substrate measurement subsystem are determined based on the first positional data of the substrate and a process recipe for the substrate. Measurements of each of the determined portions of the substrate are obtained by one or more sensing components of the substrate measurement subsystem. The obtained measurements of each of the determined portions of the substrate are transmitted to a system controller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.