Semiconductor processing chamber for improved precursor flow
US12340979B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2018 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | May 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32889
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Exemplary semiconductor processing systems may include a processing chamber, and may include a remote plasma unit coupled with the processing chamber. Exemplary systems may also include an adapter coupled with the remote plasma unit. The adapter may include a first end and a second end opposite the first end. The adapter may define an opening to a central channel at the first end, and the central channel may be characterized by a first cross-sectional surface area. The adapter may define an exit from a second channel at the second end, and the adapter may define a transition between the central channel and the second channel within the adapter between the first end and the second end. The adapter may define a third channel between the transition and the second end of the adapter, and the third channel may be fluidly isolated from the central channel and the second channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.