Sensor metrology data integration
US12366853B2 · kind B2 · utility
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13References
20Claims
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Key dates
| Filing date | Feb 27, 2023 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Feb 27, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method includes identifying sets of sensor data associated with wafers processed via wafer processing equipment and identifying sets of metrology data associated with the wafers processed via the wafer processing equipment. The method further includes generating sets of aggregated sensor-metrology data, each of the sets of aggregated sensor-metrology data including a respective set of sensor data and a respective set of metrology data. The method further includes causing, based on the sets of aggregated sensor-metrology data, performance of a corrective action associated with the wafer processing equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.