Integrated circuit structures having cut metal gates with dielectric spacer fill
US12382721B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2021 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Dec 7, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0149
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An integrated circuit structure includes a first vertical arrangement of horizontal nanowires and a second vertical arrangement of horizontal nanowires. A first gate stack is over the first vertical arrangement of horizontal nanowires, and a second gate stack is over the second vertical arrangement of horizontal nanowires. An end of the second gate stack is spaced apart from an end of the first gate stack by a gap. A first dielectric gate spacer is laterally around the first gate stack and has a portion along an end of the first gate stack and in the gap. A second dielectric gate spacer is laterally around the second gate stack and has a portion along an end of the second gate stack and in the gap. The portion of the second dielectric gate spacer is laterally merged with the portion of the first dielectric gate spacer in the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.