Plasma-enhanced deposition of film stacks
US12385138B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2023 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Oct 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67207
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of depositing a film stack including films of different compositions in a process station using a plasma is described. The method includes: in a first plasma-activated film deposition phase, depositing a first film having a first film composition on a substrate, and, in a second plasma-activated deposition phase, depositing a second film having a second film composition on the first film, where the second film composition is different from the first film composition. Deposition of the first film can include delivering at least two first deposition phase reactants to the process station via a delivery line; and deposition of the second film can include delivering at least two second deposition phase reactants to the process station via the same delivery line that was used during deposition of the first film. The method may also include a step of purging the delivery line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.