Method of inspecting tip of atomic force microscope and method of manufacturing semiconductor device
US12385946B2 · kind B2 · utility
0Cited by
7References
8Claims
0Family size
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Key dates
| Filing date | Aug 1, 2022 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Jan 29, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/053
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of operating an atomic force microscope (AFM) is provided. The method includes inspecting a sample by using the AFM and inspecting a tip of a probe of the AFM by using a characterization sample. The characterization sample includes a first characterization pattern that includes a line and space pattern of a first height, a second characterization pattern that includes a line and space pattern of a second height that is lower than the first height, and a third characterization pattern that includes a line and space pattern of a third height that is lower than the second height, and includes a rough surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.