Methods and systems for filling a gap
US12406881B2 · kind B2 · utility
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24References
17Claims
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Key dates
| Filing date | Feb 25, 2022 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | Jul 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are methods and systems for filling a gap. An exemplary method comprises providing a substrate to a reaction chamber. The substrate comprises the gap. The method further comprises at least partially filling the gap with a gap filling fluid. The methods and systems are useful, for example, in the field of integrated circuit manufacture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.