Mount for supporting substrates and plasma processing apparatus using the same
US5275683A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Oct 23, 1992 |
| Grant date | Jan 4, 1994 |
| Priority date | — |
| Expiry date | Oct 23, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S156/915
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer mount is arranged in a process chamber of the plasma etching apparatus. The rim section of a susceptor which serves as a mount body is curved at a large curvature radius. An electrostatic chuck sheet is arranged on the top of the susceptor and its rim is curved downward along the curved rim section of the susceptor, departing from the marginal portion of a semiconductor wafer mounted thereon as it comes outward. The rim of the electrostatic chuck sheet can be thus shortened in the horizontal direction and this enables a conductive film in the electrostatic chuck sheet to be made longer in the same direction. The electrostatic and thermal connection of the wafer to the electrostatic chuck sheet can be thus enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.