Method for manufacturing micro-mechanical components using selective anodization of silicon
US5542558A · kind A · utility
21Cited by
10References
5Claims
0Family size
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Key dates
| Filing date | Sep 19, 1994 |
| Grant date | Aug 6, 1996 |
| Priority date | — |
| Expiry date | Sep 19, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/96
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for manufacturing micro-mechanical components in which a structure is produced on a silicon layer, which is to be undercut in a further step. The silicon is selectively anodized for this undercutting operation. Thus, the method enables the manufacturing of micro-mechanical components that can be integrated together with bipolar circuit elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.