Integrated circuit having local interconnect for reduing signal cross coupled noise

US5717242A · kind A · utility

Assignee

• Advanced Micro Devices, Inc. · US

Inventors

• Mark W. Michael · Cedar Park, US
• Robert Dawson · Austin, US
• Basab Bandyopadhyay · Austin, US
• H. Jim Fulford · Austin, US
• Fred N. Hause · Austin, US
• William S. Brennan · Austin, US

Key dates

• Filing date: Apr 17, 1996
• Grant date: Feb 10, 1998
• Expiry date: Apr 17, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit is provided having an improved interconnect structure. The interconnect structure includes a power-coupled local interconnect which is always retained at VDD or VSS (i.e., ground) level. The local interconnect resides a dielectric-spaced distance below critical runs of overlying interconnect. The powered local interconnect serves to sink noise transients from the critical conductors to ensure that circuits connected to the conductors do not inoperably function. Accordingly, the local interconnect extends along a substantial portion of the conductor length, and is either wider or narrower than the conductor under which it extends. The local interconnect can either be polysilicon, doped polysilicon, polycide, refractory metal silicide, or multi-level refractory metal.