Robert Dawson
135Patents
30h-index
33Co-inventors
90Inventor score
Filing activity: Jan 18, 1982 → Oct 2, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6111260A | Method and apparatus for in situ anneal during ion implant | Electricity | 279 | Expired |
| US5850105A | Substantially planar semiconductor topography using dielectrics and chemical mechanical polish | Electricity | 261 | Expired |
| US5953626A | Dissolvable dielectric method | Electricity | 110 | Expired |
| US5516729A | Method for planarizing a semiconductor topography using a spin-on glass material with a variable chemical-mechanical polish rate | Emerging Cross-Sectional Technologies | 106 | Expired |
| US5918129A | Method of channel doping using diffusion from implanted polysilicon | Electricity | 105 | Expired |
| US6060345A | Method of making NMOS and PMOS devices with reduced masking steps | Electricity | 104 | Expired |
| US5759913A | Method of formation of an air gap within a semiconductor dielectric by solvent desorption | Electricity | 99 | Expired |
| US5827776A | Method of making an integrated circuit which uses an etch stop for producing staggered interconnect lines | Electricity | 79 | Expired |
| US5885877A | Composite gate electrode incorporating dopant diffusion-retarding barrier layer adjacent to underlying gate dielectric | Electricity | 69 | Expired |
| US5930642A | Transistor with buried insulative layer beneath the channel region | Electricity | 68 | Expired |
| US5899732A | Method of implanting silicon through a polysilicon gate for punchthrough control of a semiconductor device | Electricity | 67 | Expired |
| US5792706A | Interlevel dielectric with air gaps to reduce permitivity | Electricity | 63 | Expired |
| US5963803A | Method of making N-channel and P-channel IGFETs with different gate thicknesses and spacer widths | Electricity | 61 | Expired |
| US5710054A | Method of forming a shallow junction by diffusion from a silicon-based spacer | Electricity | 59 | Expired |
| US5783864A | Multilevel interconnect structure of an integrated circuit having air gaps and pillars separating levels of interconnect | Electricity | 55 | Expired |
| US6137182A | Method of reducing via and contact dimensions beyond photolithography equipment limits | Electricity | 55 | Expired |
| US6225151A | Nitrogen liner beneath transistor source/drain regions to retard dopant diffusion | Electricity | 51 | Expired |
| USD304424S | Tamper proof container closure | General | 47 | Expired |
| US5503882A | Method for planarizing an integrated circuit topography | Electricity | 46 | Expired |
| US5899727A | Method of making a semiconductor isolation region bounded by a trench and covered with an oxide to improve planarization | Electricity | 45 | Expired |
| US5963783A | In-line detection and assessment of net charge in PECVD silicon dioxide (oxide) layers | Electricity | 44 | Expired |
| US5888675A | Reticle that compensates for radiation-induced lens error in a photolithographic system | Physics | 43 | Expired |
| US6259142A | Multiple split gate semiconductor device and fabrication method | Electricity | 41 | Expired |
| US5840451A | Individually controllable radiation sources for providing an image pattern in a photolithographic system | Emerging Cross-Sectional Technologies | 39 | Expired |
| US5814555A | Interlevel dielectric with air gaps to lessen capacitive coupling | Electricity | 38 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.