Inventor · Austin, TX, US

William S. Brennan

57Patents

17h-index

36Co-inventors

80Inventor score

Filing activity: Apr 17, 1996 → May 7, 2012

Most-cited inventions

Patent	Title	Area	Cited by	Status
US6955928B1	Closed loop residual gas analyzer process control technique	Electricity	383	Expired
US5850105A	Substantially planar semiconductor topography using dielectrics and chemical mechanical polish	Electricity	261	Expired
US5953626A	Dissolvable dielectric method	Electricity	110	Expired
US5759913A	Method of formation of an air gap within a semiconductor dielectric by solvent desorption	Electricity	99	Expired
US5827776A	Method of making an integrated circuit which uses an etch stop for producing staggered interconnect lines	Electricity	79	Expired
US5792706A	Interlevel dielectric with air gaps to reduce permitivity	Electricity	63	Expired
US5783864A	Multilevel interconnect structure of an integrated circuit having air gaps and pillars separating levels of interconnect	Electricity	55	Expired
US5899727A	Method of making a semiconductor isolation region bounded by a trench and covered with an oxide to improve planarization	Electricity	45	Expired
US5814555A	Interlevel dielectric with air gaps to lessen capacitive coupling	Electricity	38	Expired
US5998293A	Multilevel interconnect structure of an integrated circuit having air gaps and pillars separating levels of interconnect	Electricity	37	Expired
US5926713A	Method for achieving global planarization by forming minimum mesas in large field areas	Electricity	36	Expired
US6208015A	Interlevel dielectric with air gaps to lessen capacitive coupling	Electricity	33	Expired
US5846876A	Integrated circuit which uses a damascene process for producing staggered interconnect lines	Electricity	28	Expired
US5926717A	Method of making an integrated circuit with oxidizable trench liner	Electricity	27	Expired
US6376330B1	Dielectric having an air gap formed between closely spaced interconnect lines	Electricity	26	Expired
US6091149A	Dissolvable dielectric method and structure	Electricity	25	Expired
US6555479B1	Method for forming openings for conductive interconnects	Electricity	18	Expired
US5783481A	Semiconductor interlevel dielectric having a polymide for producing air gaps	Electricity	17	Expired
US5717242A	Integrated circuit having local interconnect for reduing signal cross coupled noise	Electricity	16	Expired
US5767012A	Method of forming a recessed interconnect structure	Electricity	14	Expired
US5968843A	Method of planarizing a semiconductor topography using multiple polish pads	Electricity	14	Expired
US6255215A	Semiconductor device having silicide layers formed using a collimated metal layer	Electricity	11	Expired
US6060389A	Semiconductor fabrication employing a conformal layer of CVD deposited TiN at the periphery of an interconnect	Electricity	11	Expired
US5854131A	Integrated circuit having horizontally and vertically offset interconnect lines	Electricity	11	Expired
US6067855A	Apparatus and method for measuring liquid level in a sealed container	Physics	11	Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.