Low RC interconnection
US5760480A · kind A · utility
14Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1995 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Sep 20, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A low RC delay interconnection pattern is formed with a low resistivity metal, such as copper, and a low dielectric constant material, such as organic polymers. An intermediate bonding layer is formed between the low resistivity metal and low dielectric constant material employing an adhesion promoter, such as a silane-based adhesion promoter. The adhesion promoter can be applied between the metal and dielectric layers or incorporated in the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.