Modular memory circuit and method for forming same
US5815427A · kind A · utility
56Cited by
20References
49Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1997 |
| Grant date | Sep 29, 1998 |
| Priority date | — |
| Expiry date | Apr 2, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A modular circuit includes a memory module that has an array of memory cells, a communication module that has communication circuitry for coupling signals between the array and external circuitry, and an interconnection module that electrically interconnects the array on the memory module and the communication circuitry on the communication module. The memory and communication modules may also be mounted to the interconnection module. Alternatively, the memory and interface modules may be electrically interconnected and mounted to each other, in which case the interconnection module is not required.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.