Semiconductor memory device having zigzag bonding pad arrangement
US5854508A · kind A · utility
8Cited by
5References
14Claims
0Family size
Assignees
Inventors
- Kazuhiko Kajigaya
- Kazuyuki Miyazawa
- Manabu Tsunozaki
- Kazuyoshi Oshima
- Takashi Yamazaki
- Yuji Sakai
- Jiro Sawada
- Yasunori Yamaguchi
- Tetsurou Matsumoto
- Shinji Udo
- Hiroshi Yoshioka
- Hirokazu Saito
- Mitsuhiro Takano
- Makoto Morino
- Sinichi Miyatake
- Eiji Miyamoto
- Yasuhiro Kasama
- Akira Endo
- Ryoichi Hori
- Jun Etoh
- Masashi Horiguchi
- Shinichi Ikenaga
- Atsushi Kumata
Key dates
| Filing date | Mar 19, 1996 |
| Grant date | Dec 29, 1998 |
| Priority date | — |
| Expiry date | Mar 19, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/908
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Herein disclosed is a semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. Thanks to this structure in which the peripheral circuits are arranged at the center portion of the chip, the longest signal transmission paths can be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.