Polishing agent used for polishing semiconductor wafers and polishing method using the same
US5866226A · kind A · utility
5Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 1996 |
| Grant date | Feb 2, 1999 |
| Priority date | — |
| Expiry date | Jun 20, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/21
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer polishing agent contains mainly a silica containing polishing agent and is added with a polyolefin type fine particle material. The novel semiconductor wafer polishing agent is capable of low brightness polishing to the back face of the wafer, sensor detection of the front and back faces of the wafer, and suppression of dust to be generated by chipping of the back face of the wafer, thereby to increase the yield of semiconductor devices. A polishing method using the polishing agent and a novel semiconductor wafer having a back face with an unconventional surface shape are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.