Method and apparatus for automatically positioning electronic dice within component packages
US5894218A · kind A · utility
85Cited by
72References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 1996 |
| Grant date | Apr 13, 1999 |
| Priority date | — |
| Expiry date | Aug 7, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of die to establish known good dice (KGD).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.