Method and apparatus for removing a substrate from a polishing pad in a chemical mechanical polishing system
US5899801A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1996 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | Oct 31, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/345
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus has a platen with a cavity with an opening to the top surface of the platen. A polishing pad is located at an upper surface of the platen. A flexible membrane is positioned in the cavity to define a first and a second volume. A pressure source is connected to the second volume to flex the membrane, and a lifting member is positioned in the first volume so that flexing of the membrane extends the lifting member through the opening to lift the substrate off the polishing pad. Alternately, de-ionized water may be forced through a passage in the platen and an aperture in the polishing pad to lift the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.