Jeffrey Marks
71Patents
29h-index
85Co-inventors
91Inventor score
Filing activity: Jan 22, 1991 → Feb 2, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9778561B2 | Vacuum-integrated hardmask processes and apparatus | Electricity | 349 | Active |
| US5399237A | Etching titanium nitride using carbon-fluoride and carbon-oxide gas | Electricity | 259 | Expired |
| US5556501A | Silicon scavenger in an inductively coupled RF plasma reactor | Electricity | 246 | Expired |
| US5350479A | Electrostatic chuck for high power plasma processing | Emerging Cross-Sectional Technologies | 149 | Expired |
| US5423945A | Selectivity for etching an oxide over a nitride | Electricity | 143 | Expired |
| US5888414A | Plasma reactor and processes using RF inductive coupling and scavenger temperature control | Electricity | 120 | Expired |
| US6518195B1 | Plasma reactor using inductive RF coupling, and processes | Electricity | 113 | Expired |
| US7271107B2 | Reduction of feature critical dimensions using multiple masks | Electricity | 108 | Expired |
| US6488807B1 | Magnetic confinement in a plasma reactor having an RF bias electrode | Electricity | 99 | Expired |
| US6068784A | Process used in an RF coupled plasma reactor | Electricity | 96 | Expired |
| US6251792A | Plasma etch processes | Electricity | 82 | Expired |
| US6444137B1 | Method for processing substrates using gaseous silicon scavenger | Electricity | 68 | Expired |
| US5477975A | Plasma etch apparatus with heated scavenging surfaces | Emerging Cross-Sectional Technologies | 63 | Expired |
| US6545420B1 | Plasma reactor using inductive RF coupling, and processes | Electricity | 61 | Expired |
| US9576811B2 | Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) | Electricity | 59 | Active |
| US6024826A | Plasma reactor with heated source of a polymer-hardening precursor material | Electricity | 56 | Expired |
| US9806252B2 | Dry plasma etch method to pattern MRAM stack | Electricity | 54 | Active |
| US7720743B1 | Methods and apparatus for online auctions and market-places utilizing program terms | Physics | 52 | Expired |
| US9257638B2 | Method to etch non-volatile metal materials | Electricity | 51 | Active |
| US5204288A | Method for planarizing an integrated circuit structure using low melting inorganic material | Emerging Cross-Sectional Technologies | 50 | Expired |
| US5899801A | Method and apparatus for removing a substrate from a polishing pad in a chemical mechanical polishing system | Performing Operations; Transporting | 43 | Expired |
| US5770099A | Plasma etch apparatus with heated scavenging surfaces | Emerging Cross-Sectional Technologies | 43 | Expired |
| US9805941B2 | Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) | Electricity | 41 | Active |
| US6218312A | Plasma reactor with heated source of a polymer-hardening precursor material | Electricity | 35 | Expired |
| US9130158B1 | Method to etch non-volatile metal materials | Electricity | 34 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.