Rapid thermal processing (RTP) system with rotating substrate

US5965047A · kind A · utility

Assignee

• Steag AST · DE

Inventors

• Werner Blersch · Bußmannshausen, DE
• Peter Gruenwald · Schelklingen, DE
• Michael Maurer · Uerdingen, DE
• Helmut Merkle · Bethesda, US
• Thomas Theiler · Ulm, DE
• Heinrich Walk · Allmendingen, DE

Key dates

• Filing date: Oct 24, 1997
• Grant date: Oct 12, 1999
• Expiry date: Oct 24, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67115
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A rapid thermal processing (RTP) chamber, wherein one wall of the chamber supporting a substrate rotates with respect to the rest of the chamber so that the substrate being treated in the RTP chamber is relatively rotated with respect to the lamps heating the substrate.