High density semiconductor package
US5990566A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 1998 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | May 20, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package and a method of fabrication are provided. The package includes multiple semiconductor dice contained in a housing, and mounted on edge to a substrate. Each die includes a polymer interconnect which attaches to a face of the die, and wraps around an end (or side) of the die. The polymer interconnect includes a flexible polymer tape with patterns of conductors. The conductors include microbumps for bonding to the die bond pads, and edge contacts for electrical connection to mating contacts on the substrate. The package also includes a force applying mechanism for biasing the dice against the substrate. In alternate embodiments, the polymer interconnect includes resilient edge contacts, cantilevered edge contacts, or multi level edge contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.