Integrated circuits using optical waveguide interconnects formed through a semiconductor wafer and methods for forming same
US6090636A · kind A · utility
86Cited by
31References
27Claims
0Family size
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Key dates
| Filing date | Feb 26, 1998 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | Feb 26, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/42
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An integrated circuit with a number of optical waveguides that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical waveguides include a highly reflective material that is deposited so as to line an inner surface of the high aspect ratio holes which may be filled with air or a material with an index of refraction that is greater than 1. These metal confined waveguides are used to transmit signals between functional circuits on the semiconductor wafer and functional circuits on the back of the wafer or beneath the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.