Joseph E. Geusic
93Patents
37h-index
13Co-inventors
85Inventor score
Filing activity: Sep 4, 1980 → Jul 27, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6630713B2 | Low temperature silicon wafer bond process with bulk material bond strength | Electricity | 313 | Expired |
| US6545314B2 | Memory using insulator traps | Electricity | 309 | Expired |
| US6025627A | Alternate method and structure for improved floating gate tunneling devices | Emerging Cross-Sectional Technologies | 224 | Expired |
| US5981350A | Method for forming high capacitance memory cells | Emerging Cross-Sectional Technologies | 180 | Expired |
| US6246606A | Memory using insulator traps | Electricity | 148 | Expired |
| US5886368A | Transistor with silicon oxycarbide gate and methods of fabrication and use | Electricity | 121 | Expired |
| US6356500B1 | Reduced power DRAM device and method | Physics | 114 | Expired |
| US6593656B2 | Multilevel copper interconnects for ultra large scale integration | Electricity | 107 | Expired |
| US6351411B2 | Memory using insulator traps | Electricity | 103 | Expired |
| US6025225A | Circuits with a trench capacitor having micro-roughened semiconductor surfaces and methods for forming the same | Electricity | 96 | Expired |
| US6143616A | Methods of forming coaxial integrated circuitry interconnect lines | Electricity | 92 | Expired |
| US6249460A | Dynamic flash memory cells with ultrathin tunnel oxides | Physics | 89 | Expired |
| US6709978B2 | Method for forming integrated circuits using high aspect ratio vias through a semiconductor wafer | Electricity | 86 | Expired |
| US6090636A | Integrated circuits using optical waveguide interconnects formed through a semiconductor wafer and methods for forming same | Physics | 86 | Expired |
| US6294813A | Information handling system having improved floating gate tunneling devices | Emerging Cross-Sectional Technologies | 86 | Expired |
| US6150188A | Integrated circuits using optical fiber interconnects formed through a semiconductor wafer and methods for forming same | Electricity | 83 | Expired |
| US6812513B2 | Method and structure for high capacitance memory cells | Emerging Cross-Sectional Technologies | 83 | Expired |
| US6140181A | Memory using insulator traps | Electricity | 79 | Expired |
| US6423613B1 | Low temperature silicon wafer bond process with bulk material bond strength | Electricity | 72 | Expired |
| US6198168A | Integrated circuits using high aspect ratio vias through a semiconductor wafer and method for forming same | Electricity | 71 | Expired |
| US6456535B2 | Dynamic flash memory cells with ultra thin tunnel oxides | Physics | 65 | Expired |
| US6331465A | Alternate method and structure for improved floating gate tunneling devices using textured surface | Emerging Cross-Sectional Technologies | 64 | Expired |
| US6526191B1 | Integrated circuits using optical fiber interconnects formed through a semiconductor wafer and methods for forming same | Electricity | 63 | Expired |
| US6232643A | Memory using insulator traps | Electricity | 63 | Expired |
| US7084451B2 | Circuits with a trench capacitor having micro-roughened semiconductor surfaces | Electricity | 57 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.