Bonding pad structure and method for manufacturing the bonding pad structure

US6140709A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Horst Muenzel · Reutlingen, DE
• Michael Offenberg · Lörrach, DE
• Udo Bischof · Wannweil, DE
• Eckhard Graf · Gomaringen, DE
• Markus Lutz · Palo Alto, US

Key dates

• Filing date: May 6, 1999
• Grant date: Oct 31, 2000
• Expiry date: May 6, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/01074
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A bonding pad structure, in particular for a micromechanical sensor, includes a substrate, an electrically insulating sacrificial layer provided on the substrate, a patterned conductor path layer buried in the sacrificial layer, a contact hole provided in the sacrificial layer, and a bonding pad base, composed of an electrically conductive material. The bonding pad base has a first region extending over the sacrificial layer, and a second layer in contact with the conductor path region and extending through the contact hole. A protective layer is provided at least temporarily on the sacrificial layer in a specific region beneath and around the bonding pad base to prevent underetching of the sacrificial layer beneath the bonding pad base during etching of the sacrificial layer in such a way that the substrate and/or the conductor path is exposed.