Integrated circuits using optical fiber interconnects formed through a semiconductor wafer and methods for forming same
US6150188A · kind A · utility
83Cited by
30References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1998 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Feb 26, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit with a number of optical fibers that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical fibers include a cladding layer and a core formed in the high aspect ratio hole. These optical fibers are used to transmit signals between functional circuits on the semiconductor wafer and functional circuits on the back of the wafer or beneath the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.