Connectors for an electrostatic chuck and combination thereof
US6151203A · kind A · utility
36Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1998 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Dec 14, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/052
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer chuck for retaining a semiconductor wafer during semiconductor wafer processing in a semiconductor wafer processing system including a connector connecting DC chucking voltage and RF biasing power to an electrode embedded in the body of the chuck. The connector for the chuck includes two or more members joined by resilient banana connections. The connector may be adapted for use as a high temperature connector for an electrostatic chuck operated at an elevated temperature and such connector includes a thermal impedance for reducing the heat transferred from the chuck to the bottom of the connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.