In-situ monitoring of linear substrate polishing operations
US6179709A · kind A · utility
116Cited by
33References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 1999 |
| Grant date | Jan 30, 2001 |
| Priority date | — |
| Expiry date | Feb 4, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.