Method of post CMP defect stability improvement
US6220941A · kind A · utility
16Cited by
21References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1998 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Oct 1, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.