Benjamin A. Bonner
11Patents
7h-index
30Co-inventors
62Inventor score
Filing activity: Oct 1, 1998 → Apr 12, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9153486B2 | CVD based metal/semiconductor OHMIC contact for high volume manufacturing applications | Electricity | 29 | Active |
| US6561381B1 | Closed loop control over delivery of liquid material to semiconductor processing tool | Electricity | 22 | Expired |
| US6220941A | Method of post CMP defect stability improvement | Performing Operations; Transporting | 16 | Expired |
| US6855043B1 | Carrier head with a modified flexible membrane | Performing Operations; Transporting | 16 | Expired |
| US7601050B2 | Polishing apparatus with grooved subpad | Performing Operations; Transporting | 10 | Active |
| US6251001A | Substrate polishing with reduced contamination | Performing Operations; Transporting | 9 | Expired |
| US6834777B2 | Closed loop control over delivery of liquid material to semiconductor processing tool | Electricity | 7 | Expired |
| US6361405B1 | Utility wafer for chemical mechanical polishing | Electricity | 6 | Expired |
| US6811470B2 | Methods and compositions for chemical mechanical polishing shallow trench isolation substrates | Electricity | 6 | Expired |
| US7179159B2 | Materials for chemical mechanical polishing | Performing Operations; Transporting | 5 | Expired |
| US7429210B2 | Materials for chemical mechanical polishing | Performing Operations; Transporting | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.